Abstract:
Simulation of micro electro mechanical system (MEMS) is well established and largely developed. But implementation or fabrication is quite difficult. The bridge of MEMS switch is very much soft but it does not touch the signal line. So there is an important factor of increasing tress. For low power consumption and high signal transfer micro machined structure is introduced. But opening of window or back side micro machining is challenging because here two wafers are taken for making the device. Different types of fabrication related problems described in this paper.